Technical selection
Specifications and configuration
Reference — Xinda LGA3647 1U cold plate
| Parameter | Documented value / configuration |
|---|---|
| Socket family | LGA 3647Conditions: scope: Manufacturer product page; physical mounting, hose ports and CPU-specific fit require drawing review |
| Listed plate length | 108 mmConditions: scope: Published nominal outer dimension, not a tolerance-controlled drawing |
| Listed plate width | 78 mmConditions: scope: Published nominal outer dimension, not a tolerance-controlled drawing |
| Listed plate height | 19.1 mmConditions: scope: Published nominal outer dimension, not a tolerance-controlled drawing |
| Listed material construction | Copper base and copper fins; microchannel liquid-cooling constructionConditions: scope: Manufacturer description; no wetted-material certificate or measured thermal/hydraulic condition supplied |
| Pictured fluid interface | The manufacturer's product image shows two metallic hose-barb-shaped fluid ports mounted on separate raised blocks of the plateConditions: scope: Visual interface type and arrangement only; no barb diameter, seal, hose compatibility or port pressure rating can be measured from the rendering |
Manufacturer reference configuration. Values and conditions apply to the named reference; the supplied configuration requires separate confirmation.
Overview
This photographed or rendered Xinda cold plate is listed for LGA3647 CPU mounting in a 1U server context. Its mounting identity and outer geometry differ from the other two socket-specific plates in this catalog.
Construction and interfaces
The manufacturer lists copper base and copper fins in a microchannel liquid plate. The image shows a separate mounting base and two hose-barb-style ports, but does not establish coolant-contact alloy certificate, channel geometry or port specification.
Selection
The supplier publishes nominal outer dimensions of 108 × 78 × 19.1 mm. Check the actual LGA3647 processor, mounting-hole pattern, clamping arrangement, contact footprint and server clearance using a controlled drawing.
Configuration options
Port interface, hose assembly, coolant specification, cleanliness, mounting kit and inspection should be defined for the project. Do not interpret these buyer inputs as documented options for every instance of this plate.
Application limits
No comparable thermal-resistance or pressure-drop curve under specified fluid/flow conditions was found on the page. Marketing TDP and lifetime statements are intentionally omitted from this procurement reference.
