Technical selection
Specifications and configuration
Reference — Xinda integrated cold plate/manifold/tube circuit example
| Parameter | Documented value / configuration |
|---|---|
| Assembly composition | Cold-plate area, distribution manifold and connecting copper tubing integrated in one pictured circuitConditions: scope: Manufacturer-described reference example; number of plates and branch geometry are not a stock specification |
| Listed material | Copper listed for the cooling circuit componentsConditions: scope: Exact grade of each wetted component requires controlled drawing and bill of materials |
| Supplier joining description | Vacuum-brazed integrated construction described by the supplierConditions: scope: Supplier claim; no joint map or assembly acceptance data published |
| Dimension control | Dimensions customized to server layoutConditions: scope: No fixed thermal footprint, port map or overall size available for this pictured circuit |
Manufacturer reference configuration. Values and conditions apply to the named reference; the supplied configuration requires separate confirmation.
Overview
This pictured assembly joins plate contact areas to a copper-tube network and a distribution member in one server-side circuit. It is an integrated purchasing object, unlike a standalone cold plate or a hose kit.
Construction and interfaces
The manufacturer describes an all-copper circuit with a vacuum-brazed integrated construction. The rendering shows several routes and a central distribution bar, but not a controlled port map or final wetted-material certificate.
Selection
Begin with the server contact locations and installation envelope, then establish each branch flow path, tube clearance and the manifold-side connections. A visually similar route is not automatically compatible with another board or rack.
Configuration options
The manufacturer states dimensions are customized. Plate footprints, branch count, port format, tube route, mounting features and inspection can be specified in an approved drawing and bill of materials.
Application limits
No published fixed outside size, pressure/flow curve, thermal resistance or leak-test criterion is tied to this photographed circuit. Marketing statements about leak elimination or cooling improvement are not adopted here.
